PURPOSE: To remove an un-measurable material at the time of securing a sensor, and ensure suitability for mass production by applying the constitution that a sensor mounting surface is divided with one groove within a contact zone between the sensor and a support body, and a small bonding surface is prepared on the mounting surface kept in parallel with a sensor layer.
CONSTITUTION: The micro sensor 8 of a differential capacitor is fixed to the internal surface of a substrate with adhesion, and formed out of a layer unit of glass, silicon and glass. Also, two grooves 31 and 32 on the mounting surface 28 of the sensor 8 are cut into a glass layer 13 in parallel with the mounting surface 28 within end parts 29 and 30. In this case, the groove 31 limits a bonding surface 33 inside the mounting surface 28, and the groove 32 as an additional interruption means is useful for preventing an excess adhesive to externally ooze via the groove 31 at a bonding process, or externally jet out or carried out via the groove 31 in a separate way. In this case, the interruption of a capillary effect in a bonding gap between the sensor 8 and the substrate is important, and the groove 31 and 32 are smoothed, thereby restraining the weakening of the glass layer 13.
HORUSUTO PURANKENHORUN
TOOMASU RINDONAA
