Title:
DEVICE FOR SOLDERING ELECTRONIC CONSTITUENT TO CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JPS62144875
Kind Code:
A
Abstract:
A device for a simultaneous soldering of at least two connecting elements (52) of an electronic structural element (54) on a circuit plate bar (50) comprises a workpiece support (44) and a laser (10) for producing the soldering energy, and has arranged two soldering beams (20) of at least approximately equal intensity, having in their path, at any time, an optic (30) for focusing the soldering beams (20) on the soldering spots. The resonator of the laser (10) is closed on both of its londitudinal sides by a semi-reflecting mirror (12) for production of a relative movement between the soldering beams (20) and the workpiece support (44), there is, at any time, a deflecting device provided, having two by a control device (48) independently adjustable mirrors (38, 40) for an operative deflection of the respective soldering beam (20).
Inventors:
LANGHANS LUTZ (DE)
MEYER FRIEDRICH (DE)
DRAKE JOHANNES (DE)
MEYER FRIEDRICH (DE)
DRAKE JOHANNES (DE)
Application Number:
JP26847986A
Publication Date:
June 29, 1987
Filing Date:
November 11, 1986
Export Citation:
Assignee:
NIXDORF COMPUTER AG
International Classes:
B23K1/00; B23K1/005; B23K26/06; B23K26/067; B23K26/00; B23K26/08; B23K26/20; H05K3/34; H05K13/04; (IPC1-7): B23K3/04; B23K26/00; B23K26/08; H05K3/34
Domestic Patent References:
| JPS5812106A | 1983-01-24 | |||
| JPS5840349A | 1983-03-09 | |||
| JPS60234768A | 1985-11-21 |
Attorney, Agent or Firm:
Kyozo Yuasa