Title:
デバイス構造体およびその形成方法
Document Type and Number:
Japanese Patent JP5657002
Kind Code:
B2
Abstract:
An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal line, and a third metal line contacting ends of the at least one first metal line and separated from the at least one second metal line. The at least one first metal line does not vertically contact any metal via and at least one second metal line may vertically contact at least one metal via. Multiple layers of interdigitated structure may be vertically stacked. Alternately, an interdigitated structure may include a plurality of first metal lines and a plurality of second metal lines, each metal line not vertically contacting any metal via. Multiple instances of interdigitated structure may be laterally replicated and adjoined, with or without rotation, and/or vertically stacked to form a capacitor.
Inventors:
ブース・ジュニア・ロジャー・エイ
クールボー・ダグラス・ディー
エシャン・エベネゼル・イー
ヘー・ツォンシャン
クールボー・ダグラス・ディー
エシャン・エベネゼル・イー
ヘー・ツォンシャン
Application Number:
JP2012526966A
Publication Date:
January 21, 2015
Filing Date:
August 26, 2010
Export Citation:
Assignee:
インターナショナル・ビジネス・マシーンズ・コーポレーションＩＮＴＥＲＮＡＴＩＯＮＡＬ ＢＵＳＩＮＥＳＳ ＭＡＣＨＩＮＥＳ ＣＯＲＰＯＲＡＴＩＯＮ
International Classes:
H01L21/822; H01L21/3205; H01L21/768; H01L23/522; H01L27/04
Attorney, Agent or Firm:
Tsuyoshi Ueno
Tasa Kind 1
About a city Yoshihiro
Tasa Kind 1
About a city Yoshihiro