To reduce the time for cleaning/drying a substrate holding chuck as well as improving throughput of the total device.

The cleaning/drying device for a substrate holding chuck, which has a holding member 31 (32 and 33) with a plurality of holding grooves 31a arrayed for holding a plurality of wafers W, is provided with a 2-fluid supply nozzle 50 that jets out N2 gas as well as pure water toward the holding groove 31a of the chuck 30's holding member 31, a cleaning liquid supply nozzle 60 that jets out pure water toward the holding member 31's side surface 31b, and an air cylinder 300 that moves the 2-duct supply nozzle 50 and the cleaning liquid supply nozzle 60 as well as the chuck 30's holding member 31 in a horizontal direction relatively along the holding member 31's longer direction, and is formed such that, driven by the air cylinder 300, the 2-fluid supply nozzle 50 jets out N2 gas plus pure water, before the cleaning liquid supply nozzle 60, toward the holding member 31's holding groove 31a.