To prevent substrate from being overbaked.

Cooling treaters 14 for cooling wafers W up to a prescribed temperature are arranged between heating treaters 11 and resist coating treatment devices 8 and development processing devices 9. Preliminary cooling units 15 are provided on the treaters 14 in a multistage. The wafers W immediately after a heating treatment of the wafers W in the treaters 11 is ended are first transferred to the units 15 by a first transfer unit 12. After that, the wafers W are transferred to the units 14 by a third transfer unit 17 and are cooled up to the prescribed temperature and, thereafter, the wafers W are transferred to the devices 8 by a second transfer unit 13.