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Title:
DEVICE FOR SWEEP-GRINDING/POLISHING/CLEANING FILLET WELDING ZONE
Document Type and Number:
Japanese Patent JP2001300777
Kind Code:
A
Abstract:

To grind/polish/clean a weld bead face as well as a lower plate face and a vertical plate face which are adjacent to the weld bead face by a single sweep-grinding mechanism.

A single grinding/polishing/cleaning mechanism 26 with which the weld bead 4 at the fillet welding zone on a lower plate 2 and a vertical plate 1 as well as each of the steel plate faces of the lower plate 2 and the vertical plate 1 which are adjacent to the weld bead 4 are simultaneously ground/polished/cleaned is formed in a way that the mechanism can be pressed against the fillet welding zone while keeping a predetermined angle by a pressing mechanism 27. An elevating/lowering mechanism 30 which elevates and lowers both of the grinding/polishing/cleaning mechanism 26 and the pressing mechanism 27 is provided.


Inventors:
KITAGAWA HISAO
SUGIURA YU
MURAYAMA HIROSHI
NAKAO HIROSHI
NAKAO YUICHI
IWAI SADAO
Application Number:
JP2000114694A
Publication Date:
October 30, 2001
Filing Date:
April 17, 2000
Export Citation:
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Assignee:
NIPPON KOKAN KK
MENTEC KIKO KK
International Classes:
B24B9/00; B23K37/08; (IPC1-7): B23K37/08; B24B9/00
Attorney, Agent or Firm:
Muneharu Sasaki (3 outside)