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Title:
DEVICE FOR TAKING OUT MOLDING, MOLDING SYSTEM, AND METHOD FOR MANUFACTURING MOLDING
Document Type and Number:
Japanese Patent JP2013039819
Kind Code:
A
Abstract:

To provide a device for taking out a molding which can suppress deformation of the molding after taking out the molding from a mold while gripping the molding and at least one of a runner and a sprue, and to provide a molding system, and a method for manufacturing a molding.

The device 40 for taking out a molding includes a housing 56 movable to the molding, a vacuum pad 62 for holding the molding, a compression coil spring 64 for energizing the vacuum pad 62 to the molding side, a chuck member 66 for holding at least one of a runner 28 and a sprue 26, and a tension coil spring 68 for returning the chuck member 66 to the housing 56 side when an energizing force of the compression coil spring 64 disappears. In such a case, since the vacuum pad 62 and the chuck member 66 move in the same direction when the housing 56 is moved in a direction separating from a mold 20, deformation of the molding can be suppressed.


Inventors:
TAKANO MASAFUMI
NISHIGUCHI KAZUO
Application Number:
JP2011179926A
Publication Date:
February 28, 2013
Filing Date:
August 19, 2011
Export Citation:
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Assignee:
FUJI XEROX CO LTD
International Classes:
B29C45/42; B29C33/44
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda