Title:
DEVICE WHICH IS USED SPECIALLY IN ELECTRONIC CONTROL DEVICE
Document Type and Number:
Japanese Patent JPH09232711
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To conduct simply a mechanical fixing of a module constitution unit by a method wherein a second group-of-constituent component support body is coupled with a first group-of-constituent component support body via a solder layer. SOLUTION: A first group-of-constituent component support body consists of a printed-wiring sheet 3. This sheet 3 is provided with a polyimide layer 7 covered with copper layers 5 and 6 and this layer 7 is coupled with a metal carrier 9 via a prepreg layer 8. A second group-of-constituent component support body consists of a multilayer substrate provided with copper layers 21 to 24. Polyimide layers 14 to 16 are respectively arranged between the copper layers. A prepreg layer 17 is mounted to the lower part of the copper layer 24, the surface of a copper layer 25 is mounted to the upper part of this layer 17 and the copper layer 25 formes the lower side of the second group-of-constituent component support body. The second support body is finally coupled with the copper layer 25 on the surface of the first support body via a solder layer 40, which is mounted to the lower part of the copper layer 25 in a large area and consists of lead/tin solder layers.
Inventors:
TOOMASU BUIIZA
DEIITAA KARU
RARUFU SHIMITSUEKU
DEIITAA KARU
RARUFU SHIMITSUEKU
Application Number:
JP2947897A
Publication Date:
September 05, 1997
Filing Date:
February 14, 1997
Export Citation:
Assignee:
BOSCH GMBH ROBERT
International Classes:
H05K1/14; H05K3/36; H05K1/00; H05K1/18; H05K3/00; H05K3/28; H05K3/34; (IPC1-7): H05K1/14; H05K3/36
Attorney, Agent or Firm:
Toshio Yano (2 outside)