To provide a device for wiping a hot-dip plated wire and a method for wiping the hot-dip plated wire, in which a wiping member used for squeezing out surplus hot-dip plated metal does not deteriorate and which allows stable wiping for a long time when the surplus hot-dip plated metal is squeezed out from the surface of the hot-dip plated wire pulled from a plating bath.

In the device for wiping a hot-dip plated wire, the wiping member 7 has a through-hole 8 through which the hot-dip plated wire 5 passes, the radius of a circle (inscribed circle 10) touching internally the through-hole 8 in the cross section perpendicular to the axial direction of the through-hole 8 is lager by 0.02 mm or more than the radius of the plated wire 5, the surface 9 of the through-hole 8 is made of a metal (wiping member metal), and the wiping member metal is a metal good in wettability to the hot-dip plated metal. An intermetallic compound layer 13 is formed in a gap between the through-hole 8 and the hot-dip plated wire 5, and the surplus hot-dip plated metal 14 is squeezed out from the surface of the hot-dip plated wire 5 by the intermetallic compound layer 13.