Title:
半導体基板を搬送および大気圧下で保管するための輸送用密閉容器の気密性を制御する装置および方法
Document Type and Number:
Japanese Patent JP7041144
Kind Code:
B2
Abstract:
There is provided a device and method for controlling a tightness of at least one transport enclosure for conveyance and atmospheric storage of semiconductor substrates, the transport enclosure including at least two ventilation ports, the device including at least one interface configured to be coupled to the transport enclosure, the interface including at least two connecting heads, at least one connecting head of the heads being formed by a measurement head configured to engage in a ventilation port of the ventilation ports of the transport enclosure, the measurement head including a projecting end piece, opening through at least one aperture, and a peripheral sealing element surrounding the end piece, all of the ventilation ports of the transport enclosure being coupled to the connecting head of the interface. There is also provided a method for controlling the tightness of the transport enclosure.
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Inventors:
Bertrand Beret
Julian Bounur
Nicola Chapel
Julian Bounur
Nicola Chapel
Application Number:
JP2019522564A
Publication Date:
March 23, 2022
Filing Date:
November 06, 2017
Export Citation:
Assignee:
Pfeiffer Bakyum
International Classes:
H01L21/677; H01L21/673
Domestic Patent References:
| JP2010147451A | ||||
| JP2007227800A | ||||
| JP2016178239A |
Foreign References:
| WO2012108418A1 | ||||
| WO2015118782A1 |
Attorney, Agent or Firm:
Soichi Takezawa
Takenouchi Masaru
Yoshinori Yokobori
Takenouchi Masaru
Yoshinori Yokobori