Title:
構造体をキャリアの主表面領域から剥離するためのデバイス及び方法
Document Type and Number:
Japanese Patent JP7032357
Kind Code:
B2
Abstract:
An embodiment is related to a device for debonding a structure from a main surface region of a carrier. The device comprises, for example, a tape for laminating to the structure, a first holder and a second holder for spanning the tape and to keep a tension of the tape. At least the second holder can be movable into a lifted position vertically offset to the main surface region of the carrier. The device can also comprise a deflecting-element for providing a deflection-line arranged between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted positon. The deflecting-element can be arranged to be moveable parallel to the carrier for moving the deflection-line parallel to the carrier and for debonding the structure, laminated to the tape, from the carrier.
Inventors:
Ziegle, Alfred
Meyer, Dominique
Powol, Daniel
Meyer, Dominique
Powol, Daniel
Application Number:
JP2019130834A
Publication Date:
March 08, 2022
Filing Date:
July 16, 2019
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG
International Classes:
B65H35/07; H01L21/683
Domestic Patent References:
| JP2003324142A | ||||
| JP2009088397A | ||||
| JP2013168616A | ||||
| JP11045934A | ||||
| JP2016181613A |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation
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