Title:
LIQUID RESIN COMPOSITION, DIE ATTACH METHOD USING THE COMPOSITION, AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF THE COMPOSITION
Document Type and Number:
Japanese Patent JP2017105883
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid resin composition excellent in flatness after screen printing, stability in a B stage state, sticking property of a dicing tape, dicing property, and adhesiveness to a lead frame.SOLUTION: The liquid resin composition comprises: (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent having at least two groups having reactivity with an epoxy group, in such an amount that the groups in (B) having reactivity with an epoxy group is 0.8 to 1.25 equivalent to one equivalent of the epoxy group in component (A); 5 to 900 parts by mass of (C) an acrylic resin with respect to total 100 parts by mass of (A) and (B); 0.05 to 10 parts by mass of (D) a curing accelerator with respect to total 100 parts by mass of (A) and (B); 50 to 600 parts by mass of (E) an inorganic filler with respect to total 100 parts by mass of (A) and (B); 10 to 900 parts by mass of (F) a diluent with respect to total 100 parts by mass of (A) to (D); and 0.01 to 2 parts by mass of (G) dimethyl silicone with respect to total 100 parts by mass of (A) and (B).SELECTED DRAWING: None
Inventors:
TSUDA KOICHI
KANAMARU TATSUYA
KANAMARU TATSUYA
Application Number:
JP2015238685A
Publication Date:
June 15, 2017
Filing Date:
December 07, 2015
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/40; C08K3/00; C08L33/00; C08L61/06; C08L63/00; C08L83/04; H01L21/52
Domestic Patent References:
| JP2015078263A | 2015-04-23 | |||
| JP2003347320A | 2003-12-05 | |||
| JP2015081269A | 2015-04-27 |
Attorney, Agent or Firm:
Mamoru Ushiki