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Title:
DIAGONAL CUTTING METHOD FOR SYNTHETIC RESIN MOLDING CONSISTING OF SOFT MULTI-LAYERED STRUCTURE
Document Type and Number:
Japanese Patent JPS6257794
Kind Code:
A
Abstract:

PURPOSE: To simultaneously and efficiently trim unnecessary parts by irradiating laser light having the wavelength of high absorptivity of light on the cutting section of a synthetic resin material from the diagonal direction thereof, thereby heating and melting the cutting section.

CONSTITUTION: CO2 laser light is particularly excellent as the laser light. The output of the laser light which can heat and melt the hard synthetic resin material layer and soft synthetic resin material layer is selected. 100W300W or 150W250W is more adequate in the case of the CO2 laser light. The speed at which both resins can be cut is selected as the moving speed of the laser light by taking the output of the laser light into consideration. 4W8m/min is suitable at 100W300W in the case of the CO2 laser light. Cutting is executed by inclining a head body 2 toward the unnecessary wf side. The satisfactory trimming is thus made possible.


Inventors:
TAKAGI MUNETANI
SANBE KAZUHISA
ITOGA KAZUMASA
Application Number:
JP19505685A
Publication Date:
March 13, 1987
Filing Date:
September 04, 1985
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
B23K26/40; B23K26/18; B23K26/38; (IPC1-7): B23K26/00; B23K26/18