PURPOSE: To simultaneously and efficiently trim unnecessary parts by irradiating laser light having the wavelength of high absorptivity of light on the cutting section of a synthetic resin material from the diagonal direction thereof, thereby heating and melting the cutting section.
CONSTITUTION: CO2 laser light is particularly excellent as the laser light. The output of the laser light which can heat and melt the hard synthetic resin material layer and soft synthetic resin material layer is selected. 100W300W or 150W250W is more adequate in the case of the CO2 laser light. The speed at which both resins can be cut is selected as the moving speed of the laser light by taking the output of the laser light into consideration. 4W8m/min is suitable at 100W300W in the case of the CO2 laser light. Cutting is executed by inclining a head body 2 toward the unnecessary wf side. The satisfactory trimming is thus made possible.
JP6232230 | A processing method of a wafer |
JPH0737559 | MANUFACTURE OF FLAT-SHAPED BATTERY |
WO/1994/007640 | SCANNING TECHNIQUE FOR LASER ABLATION |
SANBE KAZUHISA
ITOGA KAZUMASA
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