Title:
DIAMETER CONTRACTION DEVICE
Document Type and Number:
Japanese Patent JP2017177209
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a diameter contraction device capable of preferably contracting a diameter of a diameter contraction object having a relatively high outer diameter with neither biting of a part of the diameter contraction object, nor interference of top bodies with each other.SOLUTION: Tips 4a of a plurality of top bodies 4 are combined to constitute an opening 4b. The plurality of top bodies 4 turn on the fulcrum support pins 8 by rotating a ring 4a, so that the tips of the plurality of top bodies 4 move radially by interlocking to make the inner diameter of the opening 4b change. The first intersection angle (θ1) between a virtual straight line from the center of a fulcrum support pin 8 to the tip of a top body 4 held by the fulcrum support pin 8 and the first tip end face is 9 degrees or more.SELECTED DRAWING: Figure 8
More Like This:
| JP5634523 | Stent graft and introducer assembly |
| WO/2017/134562 | DEFORMABLE TIP FOR STENT DELIVERY AND METHODS OF USE |
| WO/2013/185133 | STENT PUSHER ASSEMBLY |
Inventors:
NO SHIZUKA
SHINAGAWA YUKI
SHINAGAWA YUKI
Application Number:
JP2016072822A
Publication Date:
October 05, 2017
Filing Date:
March 31, 2016
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
A61F2/95; B21G3/14; B21D41/04; B25B7/04
Domestic Patent References:
| JP2014523294A | 2014-09-11 | |||
| JP2013503016A | 2013-01-31 |
Foreign References:
| US20020138966A1 | 2002-10-03 | |||
| US20040128818A1 | 2004-07-08 |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation
Previous Patent: Conveyance heating device
Next Patent: A flux constituent, a solder constituent, and an electronic circuit card
Next Patent: A flux constituent, a solder constituent, and an electronic circuit card