To provide a field emission element containing a thermally conductive film of integrated circuit package, a low-k dielectric layer of integrated circuit multilevel wiring, a heat conductive adhesion film, a heat conductive film of thermoelectric cooling element, a passivation film for integrated circuit elements (ICs) and a field-emission cathode.
A diamondoid includes a low-class diamondoid, a recently provided high class diamondoid, and substituted and non-substituted diamondoid. The diamondoid containing material may be processed as a polymer containing diamondoid, a sintered ceramics containing diamondoid, a diamondoid-ceramic complex, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene complex. The system paves the way for new applications of the diamondoid containing material in microelectronics.
CARLSON ROBERT M
LIU SHENGGAO
Hajime Asamura
Katsunori Ando
Yukihiro Ikeda
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