Title:
DIAMOND DIE FOR SUPER-EXTRA FINE WIRE
Document Type and Number:
Japanese Patent JP2005177806
Kind Code:
A
Abstract:
To provide a diamond die for drawing a wire capable of forming a hole with high accuracy even by a die for an extra fine wire in which the minimum diameter of the hole is ≤ 20 μm.
The diamond die comprises a diamond having a hole for working a wire of the wire diameter of ≤ 20 μm, a case member with the diamond fixed thereto, and a fixing member to fix the diamond to the case member, and an outlet side of the hole in the diamond is formed of only a back relief. Further, a single crystal diamond is used for the diamond, the case member is provided on an inlet side of the hole, and the diamond is fixed by providing the fixing member on the outlet side of the hole.
Inventors:
SHIGA TOSHINORI
YUGAWA MINORU
FUTAGAMI SHINJI
SUMIMOTO SHIGETOSHI
YUGAWA MINORU
FUTAGAMI SHINJI
SUMIMOTO SHIGETOSHI
Application Number:
JP2003422050A
Publication Date:
July 07, 2005
Filing Date:
December 19, 2003
Export Citation:
Assignee:
ALLIED MATERIAL CORP
International Classes:
B21C3/02; B21C1/00; B21C3/12; (IPC1-7): B21C3/02; B21C1/00; B21C3/12
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