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Title:
DIAMOND GRINDING WHEEL AND DIAMOND GRINDING METHOD, GROUND DIAMOND BODY OBTAINED THEREBY, SINGLE-CRYSTAL DIAMOND, SINTERED DIAMOND BODY, COMPOSITE DIAMOND GRINDING WHEEL, AND DIAMOND GRINDING WHEEL SEGMENT
Document Type and Number:
Japanese Patent JP3717046
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To attain an inexpensive grinding wheel for diamond and a diamond grinding method capable of grinding single crystal diamond, diamond thin film, sintered diamond body or the like at low temperature without causing cracking, fracture, or deterioration, maintaining stable performance of an abrasive, and attaining stable grinding quality by simple operation.
SOLUTION: This diamond grinding wheel has major constituents formed out of an intermetallic compound of one or more elements selected out of a group of Al, Cr, Mn, Fe, Co, Ni, Cu and one or more elements selected out of a group of Zr, Hf, V, Nb, Mo, Ta, W. This diamond grinding method includes pressing the grinding wheel against the diamond relatively rotating or moving the grinding wheel at room temperature or, as necessary, while heating a portion to be ground to 100 to 800°C.


Inventors:
Toshihiko Abe
Hashimoto, etc.
Shuichi Takeda
Application Number:
JP2000012479A
Publication Date:
November 16, 2005
Filing Date:
January 21, 2000
Export Citation:
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Assignee:
National Institute of Advanced Industrial Science and Technology
Toshihiko Abe
Hashimoto, etc.
Applied Diamond Co., Ltd.
International Classes:
B24B19/22; B24D3/00; B24D3/14; (IPC1-7): B24D3/00; B24B19/22; B24D3/14
Domestic Patent References:
JP5177548A
JP2000273568A
JP1161315A
JP1171198A
Attorney, Agent or Firm:
Isamu Ogoshi