To suppress deflection of a working surface in submicron order and to precisely align the height of a cutting edge of a tip part of diamond abrasive grain.
The working surface of a diamond grinding wheel 3 formed into a prescribed shape by hardening diamond abrasive grain 1 by bond 2 is ground into a true circular shape or a planar shape by a working type truing method with high accuracy so that diamond abrasive grain 1 and the bond 2 may be substantially flush with each other, the diamond abrasive grain 1 is projected by uniformly dressing the surface of the ground bond 2 to a prescribed depth, and the tip part of the diamond abrasive grain 1 projected from the bond 2 is thermochemically polished and is flatly and smoothly faired to form the diamond grinding wheel 3 with the aligned height of the cutting edge.
TAMURA TOSHIO
OCHIAI YUJI
AIKAWA SHIGEO
