Title:
DIAMOND LAPPING TAPE
Document Type and Number:
Japanese Patent JPH0419076
Kind Code:
A
Abstract:
PURPOSE: To obtain a diamond lapping tape excellent in durability and grindability by providing diamond grain, deposited by a vapor phase synthesizing method, on the surface of a base film provided with heat resistance of 600°C or more and a deflectable property.
CONSTITUTION: Diamond grain 2 deposited by a vapor phase synthesizing method grows in the state of being rigidly entwined with the material surface forming a base film 1. Furthermore, the reaction temperature is as high as 600 - 1000°C, and carbide is formed on the contact interface when carbon is diffused on the surface of the material 1 or a part of the diamond grain is solid-solubilized to the material 1, so that this diamond grain 2 has strong binding force to the base film 1.
Inventors:
ITO HAJIME
YAMASHITA HIROAKI
KIKUCHI NORIBUMI
SHIBUYA TAKUMI
WATANABE TATSUYOSHI
YAMASHITA HIROAKI
KIKUCHI NORIBUMI
SHIBUYA TAKUMI
WATANABE TATSUYOSHI
Application Number:
JP12256390A
Publication Date:
January 23, 1992
Filing Date:
May 11, 1990
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23D67/08; B24D3/00; B24D11/00; (IPC1-7): B24D11/00
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
Next Patent: JPH0419077