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Title:
DIAMOND POLISHED BODY, SINGLE CRYSTAL DIAMOND AND DIAMOND SINTERED BODY OBTAINED BY DIAMOND POLISHING WHEEL
Document Type and Number:
Japanese Patent JP2003211361
Kind Code:
A
Abstract:

To provide a low-cost diamond polishing wheel and a diamond polished body or the like polished by the diamond polishing wheel capable of polishing single crystal diamond, a diamond thin film, a diamond sintered body, or the like at a low temperature without producing a crack, breaking or degradation of quality and maintain stable performance of abrasives with simple operation and stable polishing quality.

The diamond polished body is polished with the diamond polishing wheel containing an intermetallic compound of one or two or more kinds of elements selected from a group of Al, Cr, Mn, Fe, Co, Ni, Cu and one or two or more kinds of elements selected from a group of Zr, Hf, V, Nb, Mo, Ta, W, at 90 vol.% or more and functioning as a grinding wheel.


Inventors:
ABE TOSHIHIKO
HASHIMOTO HITOSHI
TAKEDA SHUICHI
Application Number:
JP2002323471A
Publication Date:
July 29, 2003
Filing Date:
January 21, 2000
Export Citation:
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Assignee:
NAT INST OF ADV IND & TECHNOL
ABE TOSHIHIKO
HASHIMOTO HITOSHI
APPLIED DIAMOND KK
International Classes:
B24D3/00; C22C14/00; C22C16/00; C22C19/03; C22C19/07; C22C21/00; C22C26/00; C22C27/02; C22C28/00; (IPC1-7): B24D3/00; C22C26/00
Attorney, Agent or Firm:
Ogoshi Isamu