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Patent Searching and Data


Title:
DIAMOND SINTERED COMPACT
Document Type and Number:
Japanese Patent JP2012126605
Kind Code:
A
Abstract:

To provide a diamond sintered compact (polycrystalline diamond) which is excellent in oxidation resistance, small in chemical wear, and high in mechanical strength and hardly undergoes cleavage and mechanical wear even upon receiving a large-load stress, to provide a method for producing the same, and to provide uses of the same.

There are provided a diamond sintered compact composed of a diamond region prepared by sintering diamond grains having an average grain diameter of 0.08-150 μm and having a larger nitrogen content than a boron content and a nondiamond region, wherein the diamond region accounts for 80-98 vol.%, the surfaces of the diamond grains contain ≥15 to ≤1,000 ppm boron, the region with a boron content of 3 ppm or less accounts for 60-95 vol.% of the diamond region and occupies 10% or more of the length of bond between diamond grains and voids may be present in a specified proportion; a method for producing the same; and a tool, die, or discharge electrode material using the diamond sintered compact.


Inventors:
TODA NAOHIRO
SHIMAZAWA KEIKO
YOSHIDA MINORU
Application Number:
JP2010279563A
Publication Date:
July 05, 2012
Filing Date:
December 15, 2010
Export Citation:
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Assignee:
SUMITOMO ELEC HARDMETAL CORP
International Classes:
C04B35/52; B23B27/14; B23B27/20
Attorney, Agent or Firm:
Tetsuji Kamidai
Naomi Kamino