To provide a large-sized diamond substrate for wire electric discharge processing, which can be easily subjected to electric discharge processing; and a method for processing the same.
Electroconductive films are formed on a cut-in surface 3 being cut by an electroconductive wire 5 and on the surfaces brought into contact with the cut-in surface 3 of an insulative diamond substrate 1. The upper and lower surfaces perpendicular to the electroconductive surfaces 2,2 are held by an electric discharge processing machine 4. Work holders 7,7 for applying an electric current to the electroconductive surfaces 2,2 from the electric discharge processing machine 4 are brought into contact with the electroconductive surfaces 2,2. The electroconductive film formed on the cut-in surface 3 is initially processed by cutting-in by the electroconductive wire 5 from the direction of the electroconductive film formed on the cut-in surface 3, and at the same time, an electroconductive path is maintained through an electroconductive layer 6 self-formed on the inner surface of the diamond substrate, and processing can be continuously performed.
YAMAMOTO YOSHIYUKI
IMAI TAKAHIRO
Norio Kagami
Jun Komatsu
Hidetake Komatsu