Title:
DIAMOND THIN FILM ELECTRONIC DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH05299705
Kind Code:
A
Abstract:
PURPOSE:To improve the resistance to environment in an electronic device in which a boron-doped diamond thin film is used. CONSTITUTION:A pair of electrodes 3 separated from each other is formed on a substrate 1, an undoped diamond thin film 2 is selectively formed between electrodes. Also, B-doped diamond thin film 4 is selectively formed on the insulating diamond thin film 2. The part of the electrodes 3 is covered with the B- doped diamond thin film 4. Further, the substrate 1 is placed in a container 6 in which an opening part 6a is provided to expose only the B-doped diamond thin film 4.
Inventors:
KATO RIE
KOBASHI KOJI
KOBASHI KOJI
Application Number:
JP9650192A
Publication Date:
November 12, 1993
Filing Date:
April 16, 1992
Export Citation:
Assignee:
KOBE STEEL LTD
International Classes:
G01K7/22; H01C7/00; H01C7/04; H01L37/00; (IPC1-7): H01L37/00; G01K7/22
Attorney, Agent or Firm:
Masanori Fujimaki