Title:
DIAMOND WHEEL FOR MACHINING INNER PERIPHERY OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2007061988
Kind Code:
A
Abstract:
To provide a longer lasting diamond wheel capable of achieving a high-quality substrate while minimizing the occurrence of chipping occurring when machining the inner periphery of the substrate.
The diamond wheel 1 is composed as follows. Five or more machining grooves, to which diamond grains are anchored, are formed to a base metal 3. The base metal is composed so that its outer diameter D is ≤10 mm and a ratio (L/D) between the length L and the outer diameter D is ≥2 and ≤50. The material of the base metal is composed of cemented carbide including WC particles having an average particle size of ≤2 μm.
Inventors:
FURUKAWA RIICHI
Application Number:
JP2005254375A
Publication Date:
March 15, 2007
Filing Date:
September 02, 2005
Export Citation:
Assignee:
ALLIED MATERIAL CORP
International Classes:
B24D5/00; B24D3/00; B24D3/06; B24D3/14; B24D3/24
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