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Title:
DIAMOND WIRE SAW
Document Type and Number:
Japanese Patent JPH1158132
Kind Code:
A
Abstract:

To provide a smooth cut surface and the correct perpendicularity of the cut surface without damaging the machinability by main beads.

This diamond wire saw comprises a metallic stranded wire 6; main beads 7 fixed to the wire 6 with the prescribed intervals; and spacers 11 which are formed around the wire 6 between the main beads 7, protect the wire 6, and prevent the movement of the main beads 7. The main bead 7 comprises a cylindrical pedestal 8 fixed around the wire 6, and a cutting abrasive grain layer 9 formed around the pedestal 8. At least one cylindrical auxiliary bead 10 with the outside diameter same as that of the main bead 7 and having the cut surface grinding function and the wire vibration preventing function is provided at the position away from an end part of the main bead 7 by the length L1 of the main bead 7 so as to satisfy the inequality of L1+L2+ L3...+Ln≤2L1, where L1, L2, L3...Ln are the length of the auxiliary beads 10.


Inventors:
KOIWA MASAHIRO
Application Number:
JP22607797A
Publication Date:
March 02, 1999
Filing Date:
August 22, 1997
Export Citation:
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Assignee:
N C DAIYAMONDO BOOTSU KK
International Classes:
B23D61/18; B28D1/08; (IPC1-7): B23D61/18; B28D1/08
Domestic Patent References:
JPS61106839A1986-05-24
JPS59100045U1984-07-06
Attorney, Agent or Firm:
Natsuo Shiotani (1 person outside)



 
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