Title:
マイクロエレクトロニクスにおけるダイヤモンドイド含有材料
Document Type and Number:
Japanese Patent JP4178030
Kind Code:
B2
Abstract:
Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite.
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Inventors:
Dar, Jeremy, Yi
Carlson, Robert, M
Liu, Shen Gao
Carlson, Robert, M
Liu, Shen Gao
Application Number:
JP2002558328A
Publication Date:
November 12, 2008
Filing Date:
January 17, 2002
Export Citation:
Assignee:
Chevron U.S.A. Inc.
International Classes:
C07C4/00; H01L23/373; C07C7/04; C07C7/12; C07C7/135; C07C13/64; C07C17/10; C07C17/16; C07C17/383; C07C17/395; C07C23/20; C07C47/347; C07C49/423; C07C205/05; C08G61/00; C08G61/02; C08G83/00; C08L65/00
Domestic Patent References:
JP7058257A | ||||
JP1181550A | ||||
JP62103367A | ||||
JP10501302A | ||||
JP2000022055A | ||||
JP6504981A | ||||
JP9501696A | ||||
JP8209352A | ||||
JP11100295A |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Katsunori Ando
Yukihiro Ikeda
Hajime Asamura
Katsunori Ando
Yukihiro Ikeda