Title:
DIAPHRAGM CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2596267
Kind Code:
B2
Abstract:
PURPOSE: To provide the device for cutting a diaphragm so that the diaphragm does not protrude to the outside from the end face of a ring by using an excimer laser.
CONSTITUTION: When the inside part of a ring 20 being necessary as a product of a diaphragm 19 is covered with a mask 18 consisting of a material in which threshold level of energy of an excimer laser required for excitation is higher enough than that of the diaphragm 19, and it is irradiated with a laser beam 12 emitted from an excimer laser main body part 11, the laser beam 12 which transmits through quartz glass 17 is radiated only to the diaphragm 19 of the part positioned in the outside from the end face of the ring 20. In such a way, as for the diaphragm 19 of the irradiated part, the coupling is cut by a molecular level and it is sublimated and eliminated as gas.
Inventors:
Nakanishi Yoshitomo
Hashimoto Nagamitsu
Hashimoto Nagamitsu
Application Number:
JP19311491A
Publication Date:
April 02, 1997
Filing Date:
August 01, 1991
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K26/00; B23K26/06; B23K26/38; (IPC1-7): B23K26/00; B23K26/06
Domestic Patent References:
| JP63121015A |
Attorney, Agent or Firm:
Tomoyuki Takimoto