Title:
DIAPHRAGM DEVICE INCLUDING LAYERED STRUCTURE
Document Type and Number:
Japanese Patent JP2023178267
Kind Code:
A
Abstract:
To provide a diaphragm device that is not easily affected by damage due to a process medium and/or other environmental effects, or is well protected from the damage due to the process medium and/or other environmental effects.SOLUTION: The present invention relates to a diaphragm device 100 comprising a flexible diaphragm section 110, wherein a first side 111 of the diaphragm section is exposed to a process medium, and a second side 112 of the diaphragm section has a layered structure 120. In the diaphragm device, the layered structure includes at least a first layer 121 and a second layer 122, the first layer has a coefficient of thermal expansion that is a value between a value of the coefficient of thermal expansion of the diaphragm section and a value of the coefficient of thermal expansion of the second layer, and the second layer has a lower transmittance than a corresponding transmittance of the diaphragm section for the process medium or a component of the process medium.SELECTED DRAWING: Figure 1
Inventors:
KONRAD SCHWANITZ
MICHAEL ZOELLER
LORENZ KEHRER
MARCO LANGENSCHWARZ
MICHAEL ZOELLER
LORENZ KEHRER
MARCO LANGENSCHWARZ
Application Number:
JP2023091463A
Publication Date:
December 14, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
WIKA ALEXANDER WIEGAND SE & CO KG
International Classes:
G01L7/08; C23C14/06; G01L9/06
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class