Title:
DICING BLADE AND MANUFACTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3440888
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To smoothly discharge chips, when a thick work is cut at a high speed by forming at least one slit at an edge tip at the outer perimeter of a ring-like blade which penetrates the edge tip in the thickness direction, with a specified depth of the slit.
SOLUTION: A dicing blade 1 comprises a ring-like blade 2 comprising a material, for example, diamond (particles). In the ring-like blade 2, an outer perimeter 2a means an edge tip, with an opening 2b formed at the center of the ring-like blade 2, and the opening 2b is connected to a holder. Meanwhile, for the dicing blade 1, a plurality of slits 3a-3d are formed at the edge tip 2a which penetrate it in the thickness direction, with the slits 3a-3d opening toward the edge tip 2a side, while a depth T1 of the representative slit 3c is set larger than the thickness of a work to be cut.
Inventors:
Yoshinori Hasegawa
Yasunobu Yoneda
Yasunobu Yoneda
Application Number:
JP17377399A
Publication Date:
August 25, 2003
Filing Date:
June 21, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01L21/301; B26D1/00; B28D5/02; H01L21/78; (IPC1-7): H01L21/301
Domestic Patent References:
| JP4245663A | ||||
| JP2186611A |
Attorney, Agent or Firm:
宮▼崎▲ 主税
Previous Patent: WAVELENGTH MULTIPLEXED LIGHT TRANSMISSION SYSTEM
Next Patent: POWER SUPPLY UNIT WITH POWER INVERTER CIRCUIT AND CONTROL THEREOF
Next Patent: POWER SUPPLY UNIT WITH POWER INVERTER CIRCUIT AND CONTROL THEREOF