Title:
DICING BLADE
Document Type and Number:
Japanese Patent JPH05144937
Kind Code:
A
Abstract:
PURPOSE: To improve yield of a chip which is cut out regarding a dicing blade used when a wafer, ceramic, etc., are finely cut and processed.
CONSTITUTION: In a dicing blade which is constituted of a cutting blade part 11 and a hub part 12 and carries out cutting processing while cutting water 20 is sprayed thereto, a through-hole 13 is formed in the hub part 12 as a feeding mechanism for feeding the cutting water 20 backward against processing direction. Since wind is generated by forming the through-hole 13 in the hub part 12, cutting water is fed out backward against processing direction. Thereby, the remaining amount of cutting water containing cutting power on a wafer can be reduced.
Inventors:
ITO KAZUYOSHI
ICHIMARU TAKESHI
ICHIMARU TAKESHI
Application Number:
JP30210391A
Publication Date:
June 11, 1993
Filing Date:
November 18, 1991
Export Citation:
Assignee:
FUJITSU MIYAGI ELECTRON KK
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Tadahiko Ito (2 outside)