PURPOSE: To prevent the temperature rising of a diamond blade, while the friction heat between the diamond blade and a wafer sheet is easily diffused by providing the mechanism for cooling the semiconductive wafer in a dicing stage.

CONSTITUTION: The ejecting nozzle 2 ejecting cooling wafer adjacently to a diamond blade 1 in contact with the part to be cut of a semiconductive wafer 3, is provided in a dicing stage 5. The dicing stage 5 includes the cooling pipe 6 for cooling the semiconductive wafer 3. For the cooling medium flowing in this cooling pipe 6, wafer or the oil cooled at most to 0°C, etc., is used. In order to cool uniformly the total surface of the dicing stage 5, the high heat conductive material such as SiC ceramic or copper, etc., is used as the material of the dicing stage 5, and its surface is polished as flatly as possible. Thus, by providing the mechanism for cooling the semiconductive wafer 3 in the dicing stage 5, the friction heat built up in the wafer sheet 7, etc., is removed, whereby the life of the diamond blade 1 can be extended.