PURPOSE: To provide a dicing device with the visual inspecting function where the chip inspection is carried out after the dicing by the dicing device, and the chip inspection can be carried out even during the alignment operation of other wafers.

CONSTITUTION: A dicing device is provided with at least an alignment means 7 to recognize the surface of a semiconductor wafer and detect the street, a cutting means 8 to cut the semiconductor wafer along the street based on the information of this alignment means, a cleaning means 10 to mesh and dry the semiconductor wafer after cutting, and a visual inspecting means 11 to recognize the surface of the semiconductor wafer after cutting and inspect the condition of the individually divided chip.