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Title:
DICING DEVICE
Document Type and Number:
Japanese Patent JP3485816
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a dicing device capable of decreasing a burden on the cost and a burden on maintenance by simplifying its structure without lowering the efficiency of a work such as a wafer.
SOLUTION: In this dicing device, since a work is not transferred from a fourth position P4 to a first position P1, if there are provided three attractive heads 2 at intervals of 90° on the same circumference of a swiveling arm 1, in a state that the maximum works W are simultaneously transferred, i.e., even in a state that the work transfer from the first position P1 to a second position P2, the work transfer from the second position P2 to a third position P3, and the work transfer from the third position P3 to the fourth position P4 are simultaneously conducted, the work transfer at this time can efficiently be conducted.


Inventors:
Masayuki Inai
Shigemitsu Koike
Hirokazu Kobayashi
Toshimichi Shimizu
Xinji Liao
Hong Chun
Liu Yongmitsu
Application Number:
JP35006998A
Publication Date:
January 13, 2004
Filing Date:
December 09, 1998
Export Citation:
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Assignee:
TAIYO YUDEN CO.,LTD.
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
International Classes:
B23D59/00; B28D5/00; B28D5/02; B65G49/07; H01L21/677; H01L21/301; H01L21/78; (IPC1-7): H01L21/301; B65G49/07; H01L21/68
Domestic Patent References:
JP5456356A
JP63288642A
JP929735A
Attorney, Agent or Firm:
Seiko Yoshida