PURPOSE: To prevent the adhesion of cut chips onto the surface of an object to be cut such as an Si substrate, and to obtain the washing effect of uniform high cleanliness by installing pure-water injection mechanisms on both sides of the blade house of a cutting section.

CONSTITUTION: Pure-water injection mechanisms (pure water showers) 3, 4 are mounted on both sides of the blade houses 1, 2 of a cutting section and pure water 7, 8 is injected from both sides of the mechanisms, thus preventing the adhesion of cut chips at the position, etc., of bonding of a object 9 to be cut such as an Si substrate. Accordingly, the generation of wire opening in wire bonding can be inhibited.