Title:
ダイシング・ダイボンドフィルム
Document Type and Number:
Japanese Patent JP4275522
Kind Code:
B2
Abstract:
A dicing die-bonding film has a supporting substrate (1), an adhesive layer (2) formed on the supporting substrate (1), and a die-bonding adhesive layer (3) formed on the adhesive layer (2), and further has a mark for recognizing the position of the die-bonding adhesive layer (3). It is possible to provide a dicing die-bonding film in which in the case where a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer (3) in the film can be recognized.
Inventors:
Ken Matsumura
Masayuki Yamamoto
Masayuki Yamamoto
Application Number:
JP2003431690A
Publication Date:
June 10, 2009
Filing Date:
December 26, 2003
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/02; C09J201/00; H01L21/52; H01L21/58; H01L21/66; H01L21/68; H01L23/544
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Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office