Title:
ダイシング・ダイボンドフィルム
Document Type and Number:
Japanese Patent JP4717051
Kind Code:
B2
Abstract:
A dicing die-bonding film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film on the pressure-sensitive adhesive layer, which, even if the semiconductor wafer is thin, is excellent in balance between holding strength of the semiconductor wafer during dicing and peeling property of its semiconductor chip obtained by dicing upon being peeled together with the die-bonding film. A dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer on a base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer comprising an acrylic acid ester as a main monomer, 10 to 30 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and the die-bonding film comprises an epoxy resin.
Inventors:
Katsuhiko Kamiya
Ken Matsumura
Shuhei Murata
Ken Matsumura
Shuhei Murata
Application Number:
JP2007314899A
Publication Date:
July 06, 2011
Filing Date:
December 05, 2007
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/02; C09J133/04; C09J163/00; H01L21/52
Domestic Patent References:
| JP20055355A | ||||
| JP2005239884A | ||||
| JP2005116920A | ||||
| JP200396412A | ||||
| JP2005263876A | ||||
| JP2007277282A | ||||
| JP2001226647A | ||||
| JP2002226796A | ||||
| JP2009135378A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office