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Title:
DICING DIE-BONDING FILM
Document Type and Number:
Japanese Patent JP2011187571
Kind Code:
A
Abstract:

To provide a dicing die-bonding film having an excellent peeling property when a semiconductor chip obtained by dicing is peeled with its die-bonding film without deteriorating a holding force while dicing a semiconductor wafer even if the semiconductor wafer is thin.

The dicing die-bonding film includes a dicing film having at least an adhesive layer formed on a supporting base material and a die-bonding film provided on the adhesive layer. The thickness of the adhesive layer is 5 to 80 μm, and when the dicing film is peeled from the die-bonding film after dicing from the die-bonding film side to at least part of the adhesive layer, the maximum value of a peeling force near the cut surface is 0.7 N/10 mm or less under the conditions of a temperature of 23°C, a peeling angle of 180°, and a peeling point moving speed of 10 mm/min.


Inventors:
SHISHIDO YUICHIRO
MATSUMURA TAKESHI
MURATA SHUHEI
Application Number:
JP2010049595A
Publication Date:
September 22, 2011
Filing Date:
March 05, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L21/301; C09J7/02; C09J11/04; C09J133/00; C09J161/10; C09J163/00; C09J201/00; H01L21/52
Domestic Patent References:
JPH0917752A1997-01-17
JP2009120822A2009-06-04
Foreign References:
WO2008032367A12008-03-20
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office



 
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