Title:
Dicing film
Document Type and Number:
Japanese Patent JP6103140
Kind Code:
B2
Abstract:
The present invention provides a substrate film for a dicing film, the substrate film including a substrate layer and an outer surface layer disposed on one primary surface of the substrate layer. The substrate film for a dicing film is characterized in that the substrate layer contains low-density polyethylene, the outer surface layer contains an ionomer resin, and the MFR (measurement method: conforming to JIS K7210, measuring conditions: temperature of 190°C, load of 21.18 N) of the ionomer resin is 3 g/10 min or less. Further provided are: a dicing film having an adhesive layer provided on the primary surface of the outer surface layer side of the substrate film for the dicing film; and a blade dicing method using the dicing film.
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Inventors:
Yoshinori Nagao
Application Number:
JP2016524156A
Publication Date:
March 29, 2017
Filing Date:
November 16, 2015
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
H01L21/301; C09J7/20; C09J133/00
Domestic Patent References:
| JP2011228399A | ||||
| JP2009200076A |
Foreign References:
| WO2012014487A1 |
Attorney, Agent or Firm:
Sumio Tanai
Masato Iida
Naoshi Fukuhara
Masato Iida
Naoshi Fukuhara