PURPOSE: To continuously cut a wafer without generating a defective part when cutting is restarted even if the wafer is once removed from a dicing table by once stopping the cutting by so cutting the wafer as to generate a partial cut rest in two crossing directions and then cutting the rest.

CONSTITUTION: A semiconductor wafer 10 is so cut as to generate a partial cut rest on a set cutting line(CL) 12 of a first direction set on the wafer 10. Then, the wafer 10 is so sequentially cut as to subsequently continuously form a semiconductor wafer part 17 having a cut rest continuously to a part having an initial cut rest for all the set CL 12 of the first direction. Then, the wafer 10 is sequentially cut along a set CL 20 of a second direction crossed with the set CL 12 of the first direction similarly to a cutting operation along the set CL 12 of the first direction. Thereafter, cut rests 30 are cut along the set CLs 12, 20 of the first and second directions.