To provide a dicing sheet which can be diced and picked up without breaking a chip while a residue of a pressure-sensitive adhesive layer is not left between projection electrodes (through electrodes).
A dicing sheet 10 comprises a base material 3, an intermediate layer 2 provided to one side thereof and made of an urethane-containing cured body, and a pressure-sensitive adhesive layer 1 provided on the intermediate layer 2 and having a thickness of 8-30 μm. The intermediate layer 2 has a storage elastic modulus G' of 104 or larger and less than 105 Pa at 23°C, and the pressure-sensitive adhesive layer 1 contains a compound having energy-beam curable double bonds in a molecule, and has the storage elastic modulus G' of 3×105 Pa or larger at 23°C. When the dicing sheet is stuck on a wafer 30 where columnar electrodes 20 of 15 μm in height and 15 μm in diameter are formed in three rows and three columns at equal intervals of 40 μm in pitch with the pressure-sensitive adhesive layer 1 interposed, the pressure-sensitive adhesive layer 1 does not come into contact with a portion of 7.5 μm or less of an electrode in the center of the columnar electrodes 20 formed in the three rows and three columns.
KANAI MICHIO
NAKANISHI YUTO
| JP2002141309A | 2002-05-17 | |||
| JP2011054940A | 2011-03-17 | |||
| JP2011258636A | 2011-12-22 | |||
| JP2005340796A | 2005-12-08 | |||
| JP2002053819A | 2002-02-19 |
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