Title:
ダイシングテープ一体型半導体背面密着フィルム
Document Type and Number:
Japanese Patent JP7160739
Kind Code:
B2
Abstract:
Provided is a dicing tape-integrated semiconductor back surface adhesion film having re-workability for bonding. A composite film X (dicing tape-integrated semiconductor back surface adhesion film) of the present invention includes a film (10) (semiconductor back surface adhesion film) and a dicing tape (20). Second peeling adhesion measured in a peeling test under a predetermined first condition, between a silicon wafer plane and a test piece derived from the film (10) bonded to the silicon wafer plane at 70°C, is greater than first peeling adhesion measured in the peeling test under the first condition between the film (10) and the dicing tape (20). In addition, fourth peeling adhesion measured in the peeling test under a predetermined second condition, between the silicon wafer plane and the test piece derived from the film (10) bonded to the silicon wafer plane at 70°C, is smaller than third peeling adhesion measured in the peeling test under the second condition between the film (10) and the dicing tape (20).
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Inventors:
Goushi Shiga
Kei Sato
Kei Sato
Application Number:
JP2019057336A
Publication Date:
October 25, 2022
Filing Date:
March 25, 2019
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/301; C09J7/38
Domestic Patent References:
| JP2016225496A | ||||
| JP2011228450A | ||||
| JP2010260912A | ||||
| JP2012028396A | ||||
| JP2000234079A | ||||
| JP2003119434A | ||||
| JP2019044089A | ||||
| JP2015212316A | ||||
| JP2019009323A | ||||
| JP2005255960A |
Attorney, Agent or Firm:
Patent Attorney Corporation G-chemical