To provide a die attach paste for semiconductor bonding use having excellent curability and reliability.
The paste contains (A) an epoxy resin, (B) an epoxy resin hardener containing a phenolic compound expressed by general formula (1) (R1 groups may be the same or different and are each independently a 1-5C alkyl; and (m) is an integer of 0-4) and one or more components selected from dicyandiamide and an imidazole compound, (C) a liquid elastomer containing epoxy group and having a number-average molecular weight of 500-5,000, (D) an acrylonitrile/butadiene copolymer containing a vinyl group or a carboxy group and having a number-average molecular weight of 500-5,000, (E) a compound having at least one radically polymerizable double bond in one molecule, (F) a radical polymerization catalyst, (G) a coupling agent and (H) a filler as essential components. The sum of the components A and B is 40-80 wt.% and the amount of the component C and the component D is 3-20 wt.% each based on the components excluding the component H.
YAGISAWA TAKASHI
