DIE ATTACH PASTE

Japanese Patent JP3313055

B2

PROBLEM TO BE SOLVED: To obtain a die attach paste for semiconductor which has excellent adhesiveness, low stress property and solder crack resistance, and further can be cured in a very short time.
SOLUTION: This die attach paste is obtained by including (A) a product by the reaction of a phosphoric acid group-containing acrylate and/or a phosphoric acid group-containing methacrylate shown by formula I with an alicylclic epoxy group-containing alkoxysilane and a monoacrylate by formula IIA or a monomethacrylate shown by formula IIB at 0-50°C, (B) a urethane diacrylate obtained by the reaction of a hydroxyalkyl acrylate with a polyalkylene glycol and a diisocyanate, (C) an initiator, and (D) silver powder, wherein R is H or CH3, (a) is 0 or 1, (b) and (c) are each 1 or 2, (b)+(c)=3, and R1 is group containing alicyclic and/or aromatic group(s) and having ten carbon atoms or more.

Tao Kazunori
Katsutoshi Ando
Toshiro Takeda

JP34690397A

August 12, 2002

December 16, 1997

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Sumitomo Bakelite Co., Ltd.

C08F290/06; C08F299/02; C08L55/00; C09J4/00; C09J4/02; C09J9/02; C09J155/00; C08K3/08; C09J175/16; C09J183/07; H01B1/22; H01L21/52; (IPC1-7): C09J4/02; C09J9/02; C09J155/00; C09J175/16; H01B1/22; H01L21/52

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