Title:
Die bonder and an adhesives coating method
Document Type and Number:
Japanese Patent JP6276552
Kind Code:
B2
Abstract:
The invention provides a chip mounting device and an adhesive coating method. Painting time can be reduced through use of a chip mounting device having two performing parts (PH) and device vibration caused by movement of the two PHs can be reduced. An adhesive coating zone can be divided into a first coating zone and a second coating zone, and the adhesive coating zone is provided with a first performing part used for coating an adhesive on the first coating zone and a second performing part used for coating the adhesive on the second coating zone. When the first performing part moves along an X axis direction and a Y axis direction to coat the adhesive on the first coating zone, the second performing part moves in directions opposite to the X and Y axis directions along which the first performing part moves to coat the adhesive on the second coating zone.
Inventors:
Masayuki Mochizuki
Ide Kirito
Yoda Mitsuo
Ide Kirito
Yoda Mitsuo
Application Number:
JP2013209326A
Publication Date:
February 07, 2018
Filing Date:
October 04, 2013
Export Citation:
Assignee:
Fasford Technology Co., Ltd.
International Classes:
H01L21/52
Domestic Patent References:
| JP2012199455A | ||||
| JP2008212922A | ||||
| JP201339528A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation
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