PURPOSE: To put a die bonder excellent in semiconductor adhesion and suitable for mass production process to practical use, by providing each of the specified cover, blow plate, and heater block.

CONSTITUTION: The following are provided; a cover 1 provided with an insertion inlet 7 for wax collet and an insertion inlet 8 for chip collet, a blow plate 2 which is arranged under the cover 1, retains a carried lead frame 3, and is provided with a plurality of gas nozzles 12 which are arranged in a rectangle type so as to surround a first and a second heater block engaging holes 9, 10 arranged in the facing positions of the above-mentioned insertion inlets 7, 8, and spout mixed gas of hydrogen and nitrogen, and a first heater block 5 and a second heater block 6 which contain a plurality of bar heaters 13, move up and down the engaging holes 9, 10 opened in the blow plate 2, come into contact with the lead frame 13 and heat it. Further, for example, a quenching circuit which interrupts the supply of hydrogen gas by a signal from a fire detector is added.