Title:
DIE-BONDING DEVICE
Document Type and Number:
Japanese Patent JP2702836
Kind Code:
B2
Abstract:
PURPOSE: To manufacture the title die-bonding device capable of securely and easily heading the wafers of a multitude of continuous chips in the same pattern as that of a reference chip by a method wherein the position of the reference chip is to be specified.
CONSTITUTION: A coordinate storage 400 stores the coordinate in a wafer shifting mechanism 200 of a reference chip as a new reference chip coordinate when the reference chip of a new wafer is probed. On the other hand, an automatic alignment mechanism 500 drives the wafer shifting mechanism 200 in a spiral shape centered on a chip positioned in the reference chip coordinate until another chip in the same pattern as that of the reference chip is probed when a chip in the other pattern than that of the reference chip is positioned in the reference chip coordinate stored in the coordinate storage 400. Furthermore, the position of the reference chip when a multitude of chips in the same pattern as that of the reference chip are continued shall be specified so that the wafer shifting mechanism 200 may be driven by picture image discernment to discern the position of the reference chip.
Inventors:
Yasuhiko Okayama
Shimonosato Keinobu
Noriwa Iwasaki
Shimonosato Keinobu
Noriwa Iwasaki
Application Number:
JP28759091A
Publication Date:
January 26, 1998
Filing Date:
November 01, 1991
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/52; H01L21/301; H01L21/68; H01L21/78; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Umeda Masaru