To provide die bonding equipment and a method, which are capable of shortening the time required for carrying out a die bonding process.
The die bonding equipment is equipped with a heating means 6 which heats a semiconductor chip T and a board S, a board transfer means 13 which transfers the boards S, a chip transfer means 15 which transfer the semiconductor chips, and an operation control means 7 which controls the operations of the means 6, 13, and 15. The operation control means 7 is equipped with a staged-heating control 71 which keeps the heating means 6 constant at a first preheating temperature or above as a minimum temperature that must be kept, raises the temperature of the heating means step by step to a second preheating temperature which is higher than the first preheating temperature but lower than the melting point of a brazing material, and furthermore raises the temperature of the heating means 6 from the second preheating temperature to a bonding temperature above the melting point of the brazing material and a preheating control 73 which raises the temperature of the heating means from the first preheating temperature up to the second preheating temperature before the board S and the semiconductor chip T are supplied to the heating means 6.
ANZAI HIROSHI
HACHIMAN NAOYUKI
GOTO SUMIO
Yoshio Arafune
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