Title:
DIE-BONDING FILM AND DICING DIE-BONDING FILM
Document Type and Number:
Japanese Patent JP2021190695
Kind Code:
A
Abstract:
To provide a die-bonding film and a dicing die-bonding film which can comparatively prevent a void from remaining between wiring boards.SOLUTION: A die-bonding film contains an acrylic resin, a phenolic resin and a filler, in which the filler has a specific surface area of 5 m2/g or more and 100 m2/g or less, and a content mass ratio of the filler to the acrylic resin is 0 or more and 1.50 or less.SELECTED DRAWING: None
Inventors:
HATAKEYAMA YOSHIHARU
ONISHI KENJI
YOSHIDA NAOKO
KIMURA TAKEHIRO
ONISHI KENJI
YOSHIDA NAOKO
KIMURA TAKEHIRO
Application Number:
JP2021072037A
Publication Date:
December 13, 2021
Filing Date:
April 21, 2021
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C08K3/013; H01L21/52; C08L33/04; C08L61/04; C08L63/00; C09J7/35; C09J7/38; C09J11/04; C09J133/00; C09J161/06; H01L21/301
Attorney, Agent or Firm:
Fujimoto Partners Corporation