Title:
DIE-BONDING SILICONE RESIN COMPOSITION, CURED PRODUCT, LIGHT-EMITTING DIODE ELEMENT, AND METHOD FOR PRODUCING SAID COMPOSITION
Document Type and Number:
Japanese Patent JP2020132743
Kind Code:
A
Abstract:
To provide a die-bonding silicone resin composition, that yields a cured product having a high hardness and little change in hardness and little decrease in mass under high-temperature condition.SOLUTION: The die-bonding silicone resin composition contains (A) a specific linear organopolysiloxane, (B) a specific branched organopolysiloxane, (C) a specific organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) a specific polyorganometallosiloxane containing Si-O-Ce bond and Si-O-Ti bond, each in a contained amount of specific range.SELECTED DRAWING: None
Inventors:
KOBAYASHI ATARU
KOUCHI SATOSHI
KOUCHI SATOSHI
Application Number:
JP2019026884A
Publication Date:
August 31, 2020
Filing Date:
February 18, 2019
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08L83/07; C08L83/05; C08L83/08; H01L21/52
Domestic Patent References:
| JP2018150493A | 2018-09-27 | |||
| JP2017088776A | 2017-05-25 | |||
| JP2011086844A | 2011-04-28 | |||
| JP2006342200A | 2006-12-21 | |||
| JP2018184579A | 2018-11-22 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi