To efficiently and automaticaly execute supply without stopping a whole shaping device, by removing die face contaminants from the die face of a die, supplying resin tablets, heating/melting the resin tablets, shaping them and giving/restoring releapsing property by means of applying release agent to the die face of the die.

A UV irradiation mechanism 17 UV-irradiates a die face 16 of the die, the die face contaminants adhered and accumulated to/in the die face 16 are resolved, and are separated and scattered from the die face 16 so as to remove the die face contaminants from the die face 16. Lead frames before shaping 3 arranged in an array part 5 and resin tablets 6 which are arranged in a loading part 7 of a shaping device 1 and which contain much release agent are transferred to respective pots through a material supply mechanism 11 and they heated, melted and shaped. At the same time, release agent is applied to the die face 16, and releasing factor is given and restored.